Sputtering including in the combination with other PVD (Physical Vapour Deposition) methods is one of the most versatile methods, offering virtually unlimited deposition possibilities. Layers deposited by this method are characterized by high density and compactness. With the method of sputtering, electrically conductive or insulating materials may be deposited onto almost any substrate (metal, ceramic, plastic). By using a substrate holder with HF bias, which can be used at temperatures up to 900°C, and deposition sources operating from DC, pulsed DC or a RF source, a huge number of coating options can be implemented.
Our deposition machines provide a uniform nano-coating ensuring the highest quality up to the last treated substrate. To increase productivity, we can equip our machines with chambers including a load lock module.